Bar solder - GENMA Europe GmbH

NP303T

Copper-free bar solder for refilling in the case of an increased copper content in the SAC305 soldering bath

NP303T

GENMA bar solder NP303T (SAC300)– copper-free alloy for refilling in the case of an increased copper content in the soldering bath. Our special production process minimizes the formation of oxides and prevents solder bridges.

Product features:

  • For use in electronics production, in wave, selective, dip soldering, and nitrogen reflow soldering systems
  • Maximum cost effectiveness through low oxide formation
  • High quality and easy to use
  • Exact, well-formed soldering joint

Technical Data:

Alloy

Sn 97 / Ag 3,0

Melting temperature °C

221 - 223