SMD solder pastes by GENMA - powerful and innovative
GENMA offers a broad range of different SMD solder pastes – the right product for each application. The suitable solution for each requirement.
Flux and powder materials for the solder paste production are produced in-house – this guarantees the top quality that makes the difference. Our modern quality management system ensures our high standards. Current market requirements are dealt with in our own development lab.
Find the right SMD solder paste with our Product Finder. Or contact us directly. We will be happy to help you!
Solder paste according to application
Alloy: Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
NP303-COSMO-LH-T4
Halide free type 4 SMD solder paste with excellent wetting properties, 12 month shelf live
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NP303-COSMO-LH-T5
Halide free type 5 SMD solder paste for extremely fine structures with excellent wetting properties
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NP303-COSMO-ZQ-C
Our top product – ROL1 SMD solder paste with the best printing and soldering properties
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NP303-CQS-1
Halide free SMD solder paste with excellent printing and soldering properties
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NP303-CQS-2
ROL0 SMD solder paste with higher viscosity and excellent printing and soldering properties
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NP303-GSD003-T6
Type 6 SMD solder paste for extremely fine structures with excellent wetting properties
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NP303-FL003-T4
Type 4 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
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NP303-FL003-T3
Type 3 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
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NP303-GM855-T4-D
Solder paste with optimized wetting properties for oxidized- and nickel surfaces
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winDot F-005-NP303 T7
SMD jet dispenser solder paste. Type 7. Dot diameters of 130µm possible
more_horizAlloy: Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5
NP406-MGM555-GK
Indium SMD solder paste for highest reliability with a significant lower melting point than SAC305
more_horizAlloy: Sn 98,3 / Ag 1,0 / Cu 0,7 / SAC107
NP110-COSMO-ZQ-C
Silver-reduced SMD solder paste with excellent printing and soldering properties
more_horizAlloy: Sn 95,5 / Ag 1 / Bi 3 / Cu 0,5
PW231-STV-GQ COSMO
SMD solder paste with increased tensile strength and anti tombstone effect - perfect for vapor phase
more_horizAlloy: Sn 96,2 / Ag 0,3 / Bi 3 / Cu 0,5
PW233-STV-GQ COSMO
SMD solder paste with increased tensile strength and anti tombstone effect - perfect for vapor phase
more_horizAlloy: Sn 96 / Ag 4 / SAC400
NP303-FL003-T4
Type 4 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
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NP303-FL003-T3
Type 3 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
more_horizAlloy: Sn 42 / Bi 58
SB58-COSMO-NH-T4
Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components. 12 Month shelf live
more_horizAlloy: Sn 42,6 / Bi 57 / Ag 0,4
SB6-HLGQ-MSD
SMD Low-temperature solder paste for pin-in-paste applications with a second reflow solder process or for very temperature-sensitive components
more_horizAlloy: Sn 91 / Ag 4 / Cu 1 / Bi 3 / Sb 1
Alloy: Sn 62 / Pb 37,6 / Ag 0,4
Alloy: Sn 95 / Sb 5
NP303-FL003-T4
Type 4 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
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NP303-FL003-T3
Type 3 SMD solder paste for formic acid soldering process. No flux residues after soldering. Bonding without washing process.
more_horizHaven’t found what you were looking for?
Do you need a different alloy or have any other requirements? We also offer products for special applications. If you can’t find a suitable product in our standard range we also offer customized products!