Type 6 SMD solder paste for extremely fine structures with excellent wetting properties
NP303-GSD003-T6 - solder paste
GENMA solder paste – our NP303-GSD003-T6 SMD solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours and consistent adhesiveness in the pick-and-place process.
Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste must be soldered under nitrogen reflow. Oxygen content during reflow 1000ppm max.
- For fine structures
- Outstanding printability
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process
Our services for you:
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
6 (5-15 µ m)
Melting temperature °C
217 - 221