NP303-GSD003-T6
Type 6 SMD solder paste for extremely fine structures with excellent wetting properties
NP303-GSD003-T6 - solder paste
GENMA solder paste – our NP303-GSD003-T6 SMD solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours and consistent adhesiveness in the pick-and-place process.
Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste must be soldered under nitrogen reflow. Oxygen content during reflow 1000ppm max.
Product features:
- For fine structures
- Outstanding printability
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process
Our services for you:
Technical Data:
Alloy
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
Flux type
ROL1
Powder size
6 (5-15 µ m)
Melting temperature °C
217 - 221
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