Solder paste Typ 5 NP303-ZYA-1 - GENMA Europe GmbH

NP303-TP100-T6

Type 6 SMD solder paste for extremely fine structures with excellent wetting properties

NP303-TP100-T6 - NEW

GENMA solder paste – our NP303-TP100-T6 SMD solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours and consistent adhesiveness in the pick-and-place process.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste must be soldered under nitrogen reflow. Oxygen content during reflow 1000ppm max.

Product features:

  • For fine structures
  • Outstanding printability
  • Excellent wetting
  • Consistent adhesiveness during the pick-and-place process

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL1

Powder size

6 ( 5-15 µ m)

Melting temperature °C

217 - 219