WinDot B-005-NP303
Jetting solder paste, Type 6, for jet dispensing
winDot Jetting solder paste for jet dispensing
GENMA jetting solder paste – our jet dispenser solder paste WINDOT shows an excellent performance. Uniform dots as small as 200µm can be jetted in a continuous process at high speed. The result are attractive soldering joints that are surrounded by clear flux residues.
The solder paste requires to be soldered under nitrogen reflow. Cleaning after soldering is not necessary.
Product features:
- Smallest possible dot size 200µm
- jetting solder paste
- No spatter
- No solder beads
- Clear residues
Our services for you:
Technical Data:
Alloy
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
Flux type
ROL1
Powder size
6 (5-15 µ m)
Melting temperature °C
217 - 221
Similar products:
winDot F-005-NP303 T7
SMD jet dispenser solder paste. Type 7. Dot diameters of 130µm possible
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