Dispenser solder paste NP303-LHY-LS - GENMA Europe GmbH

WinDot B-005-NP303

Jetting solder paste, Type 6, for jet dispensing

winDot Jetting solder paste for jet dispensing

GENMA jetting solder paste – our jet dispenser solder paste WINDOT shows an excellent performance. Uniform dots as small as 200µm can be jetted in a continuous process at high speed. The result are attractive soldering joints that are surrounded by clear flux residues.

The solder paste requires to be soldered under nitrogen reflow. Cleaning after soldering is not necessary.

Product features:

  • Smallest possible dot size 200µm
  • jetting solder paste
  • No spatter
  • No solder beads
  • Clear residues

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL1

Powder size

6 (5-15 µ m)

Melting temperature °C

217 - 219