Dispenser solder paste NP303-LHY-LS - GENMA Europe GmbH

WinDot B-005-NP303

Jetting solder paste, Type 6, for jet dispensing

winDot Jetting solder paste for jet dispensing

GENMA jetting solder paste – our jet dispenser solder paste WINDOT shows an excellent performance. Uniform dots as small as 100µm can be jetted in a continuous process at high speed. The result are attractive soldering joints that are surrounded by clear flux residues.

Applications:
- 3D-MID, 3-dimensional non printable PCBs
- Small and large components on same board
- Adding solder paste after printing
- non-printable substrates like flexible PCBs
- high performance modules
- cavity PWBs
- LED
- Connecting small wires with high precision

Product features:

  • jetting solder paste
  • No spatter
  • No solder beads
  • Clear residues

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL1

Powder size

6 ( 5-15 µ m)

Melting temperature °C

217 - 219