Solder paste Typ 5 NP303-ZYA-1 - GENMA Europe GmbH

NP303-MF155-GQ

High thixotropic SMD solder paste with good printing properties

NP303-MF155-GQ solder paste

GENMA SMD solder paste – our NP303-MF155-GQ solder paste features a good printability, sufficient tackiness on the stencil, and a good adhesiveness during the pick-and-place process. Its good wetting properties guarantee consistent soldering joints. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Good printability
  • Good adhesiveness during the pick-and-place process
  • High contours stability

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221