
NP303-MF155-GQ
High thixotropic SMD solder paste with good printing properties
NP303-MF155-GQ solder paste
GENMA SMD solder paste – our NP303-MF155-GQ solder paste features a good printability, sufficient tackiness on the stencil, and a good adhesiveness during the pick-and-place process. Its good wetting properties guarantee consistent soldering joints. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
Product features:
- Good printability
- Good adhesiveness during the pick-and-place process
- High contours stability
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Technical Data:
Alloy
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
Flux type
ROL1
Powder size
4 (22-38 µ m)
Melting temperature °C
217 - 221