NP303-DPS101-T5
Air bubble free SMD dispenser solder paste for laser or reflow soldering
NP303-DPS101-T5 solder paste
GENMA SMD solder paste – our dispenser solder paste NP303-DPS101-T5 was developed to meet the high requirements during laser-soldering and it also makes for excellent results with reflow soldering. The solder paste does not splatter and creates no tin beads or flux spatter beside the soldering joint. It produces attractive soldering joints that are surrounded by clear flux residues.
The solder paste features a consistent adhesiveness during the pick-and-place process. Its consistent viscosity provides for an even and reproducible dispenser application. Our NP303-DPS101-T5 is vacuum degassed, which ensures uninterrupted dispensing even in automated applications.
Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
Product features:
- SMD dispenser solder paste
- Application: Laser or reflow soldering
- Vacuum degassed; Air bubble free solder paste - Also ideal for automated applications.
- No spatter
- No solder beads
- Clear residues
Our services for you:
Technical Data:
Alloy
Flux type
Powder size
Melting temperature °C
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