Low-temperature SMD solder paste for the second reflow solder process or extremely temperature-sensitive components
GENMA SMD solder paste – our SB2-MT355-GK is a low-temperature solder paste that is used in areas where a second reflow solder process is necessary or for temperature-sensitive components. The solder paste features good wetting properties and prints well.
Cleaning after soldering is not necessary. The low-temperature solder paste can be soldered under air or nitrogen reflow.
- Low-temperature SMD solder paste
- Good wetting properties
- Good printability