Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components
GENMA solder paste – our SB6-HLGQ-20 is a low-temperature solder paste. Because of the low melting point it is used in areas where a second reflow solder process is necessary or for temperature-sensitive components. The solder paste features good wetting properties and prints well.
Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- Low melting point
- Good wetting properties
- Good printability
- Halide free - fulfilling Apple standard