Low temperature solder paste SB6-HLGQ-20 - GENMA Europe GmbH


Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components


GENMA solder paste – our SB6-HLGQ-20 is a low-temperature solder paste. Because of the low melting point it is used in areas where a second reflow solder process is necessary or for temperature-sensitive components. The solder paste features good wetting properties and prints well.

Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Low melting point
  • Good wetting properties
  • Good printability
  • Halide free - fulfilling Apple standard

Technical Data:


Sn 42,6 / Bi 57 / Ag 0,4

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

139 - 141