Silver-reduced solder paste with excellent printing and soldering properties
GENMA solder paste – NP110-COSMO-ZQ-C is the silver-reduced version of our SAC305 solder paste NP303-COSMO-ZQ-C. The version with the lower silver content also convinces with its outstanding printability, extremely long open time on the stencil, and the consistent adhesiveness during the pick-and-place process. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates the material planning. Moreover, solder paste can be transported without cooling.
Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- Outstanding printability
- Excellent wetting
- Extremely long open time
- Consistent adhesiveness
- Solder connections low in voids