Solder paste NP303-GM855-GQ-2-1 - GENMA Europe GmbH

NP303-GM855-T4-D

Solder paste with optimized wetting properties for oxidized- and nickel surfaces

NP303-GM855-T4-D

The NP303-GM855-T4-D SMD solder paste was developed by GENMA especially for wetting oxidized surfaces and nickel surfaces. Nickel and oxidized surfaces do cause problems from time to time. The cause are often cheap PCBs or too long stocked components and PCBs with thick oxide layers. This solder paste does show good wetting properties on difficult surfaces such as nickel and reliably removes oxide layers.

The solder paste convinces with its excellent printability. Printability and solder behavior are maintained at the same level even after 24 hours.

The solder paste can be soldered under air or nitrogen reflow. Cleaning after soldering is not necessary.

Product features:

  • Optimized for nickel and oxidized surfaces
  • Excellent wetting
  • Good printability

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219