NP303-COSMO-LH-T4 solder paste

GENMA solder paste – our proven COSMO solder paste is now halide free available. The NP303-COSMO-LH-T4 SMD solder paste convinces with its outstanding printability, highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering joints on BGAs. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates material planning. Moreover, solder paste can be transported without cooling.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

Outstanding printability
Long open time on stencil
Excellent wetting
Consistent adhesiveness for >8h after printing for a high reliable pick-and-place process
Halide free L0. No added halides. Highest reliability.
Minimum shelf life of 12 months, transport without cooling
Hardly any voids
Same solder paste also available with Type 5 powder for smaller apertures
Perfect suited for vapor phase ovens - tombstoning is suppressed
No-clean flux can remain on the soldering joint. Residue-free cleaning of the flux possible

Our services for you:

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL0-halogen-free

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221

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NP303-COSMO-LH-T5

Halide free type 5 SMD solder paste for extremely fine structures with excellent wetting properties