Solder paste NP303-COSMO-ZQ-C - GENMA Europe GmbH


Our top product – ROL1 SMD solder paste with the best printing and soldering properties

NP303-COSMO-ZQ-C solder paste

GENMA SMD solder paste – our NP303-COSMO-ZQ-C solder paste convinces with its outstanding printability, extra-long open time on the stencil, and a consistent adhesiveness during the pick-and-place process. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates material planning. Moreover, solder paste can be transported without cooling.

Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Outstanding printability
  • Minimum shelf life of 12 months, transport without cooling
  • Extremely long tackiness
  • Consistent adhesiveness for >8h after printing for a high reliable pick-and-place process
  • Solder connections low in voids

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221