Solder paste NP303-COSMO-ZQ-C - GENMA Europe GmbH

NP303-COSMO-ZQ-C

Our top product – ROL1 solder paste with the best printing and soldering properties

NP303-COSMO-ZQ-C

GENMA solder paste – our NP303-COSMO-ZQ-C solder paste convinces with its outstanding printability, extra-long open time on the stencil, and a consistent adhesiveness during the pick-and-place process. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates material planning. Moreover, solder paste can be transported without cooling.

Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Outstanding printability
  • Minimum shelf life of 12 months, transport without cooling
  • Extremely long tackiness
  • Consistent adhesiveness during the pick-and-place process
  • Solder connections low in voids

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219