NP303-CQS-1
Halide free SMD solder paste with excellent printing and soldering properties
NP303-CQS-1 solder paste
GENMA SMD solder paste – our NP303-CQS-1 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process.
Its excellent wetting properties guarantee perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
Product features:
- Outstanding printability
- Long open time
- Consistent adhesiveness during the pick-and-place process
- Few residues
- Solder connections low in voids
Our services for you:
Technical Data:
Alloy
Flux type
Powder size
Melting temperature °C
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