Solder paste NP303-CQS-1 - GENMA Europe GmbH


Halide free SMD solder paste with excellent printing and soldering properties

NP303-CQS-1 solder paste

GENMA SMD solder paste – our NP303-CQS-1 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process.

Its excellent wetting properties guarantee perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Outstanding printability
  • Long open time
  • Consistent adhesiveness during the pick-and-place process
  • Few residues
  • Solder connections low in voids

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221