Our standard ROL0 solder paste with excellent printing and soldering properties
GENMA solder paste – our NP303-CQS-1 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process.
Its excellent wetting properties guarantee perfect soldering joints - also on BGAs. Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- Outstanding printability
- Long open time
- Consistent adhesiveness during the pick-and-place process
- Few residues
- Solder connections low in voids