Solder paste NP303-CQS-2 - GENMA Europe GmbH


ROL0 SMD solder paste with higher viscosity and excellent printing and soldering properties

NP303-CQS-2 solder paste

GENMA SMD solder paste – our NP303-CQS-2 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process. Its excellent wetting properties guarantee perfect soldering joints. Its higher viscosity compared to NP303-CQS-1 allows extremely precise printing with sharp contours. The pick-and-place process and soldering of BGAs is thus optimized.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • High contour stability
  • Optimized for BGAs
  • Consistent adhesiveness during the pick-and-place process
  • Few residues
  • Solder connections low in voids

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221