ROL0 solder paste with higher viscosity and excellent printing and soldering properties
GENMA solder paste – our NP303-CQS-2 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process. Its excellent wetting properties guarantee perfect soldering joints. Its higher viscosity compared to NP303-CQS-1 allows extremely precise printing with sharp contours. The pick-and-place process and soldering of BGAs is thus optimized.
Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- High contour stability
- Optimized for BGAs
- Consistent adhesiveness during the pick-and-place process
- Few residues
- Solder connections low in voids