Solder paste NP303-CQS-2 - GENMA Europe GmbH

NP303-CQS-2

ROL0 solder paste with higher viscosity and excellent printing and soldering properties

NP303-CQS-2

GENMA solder paste – our NP303-CQS-2 solder paste convinces with its outstanding printability, long open time on the stencil, and a consistent adhesiveness during the pick-and-place process. Its excellent wetting properties guarantee perfect soldering joints. Its higher viscosity compared to NP303-CQS-1 allows extremely precise printing with sharp contours. The pick-and-place process and soldering of BGAs is thus optimized.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • High contour stability
  • Optimized for BGAs
  • Consistent adhesiveness during the pick-and-place process
  • Few residues
  • Solder connections low in voids

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL0

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219