T220-FL003-T3 solder paste

GENMA solder paste - our T220-FL003-T3 solder paste was developed for use with formic acid (HCOOH) in vacuum soldering systems. The flux in our T220-FL003-T3 dissolves without leaving any residue. DIE bonding can be carried out directly after soldering without cleaning on a 100% process-safe surface.

The solder paste provides a clean surface without residue after the soldering process in the vacuum contact heat or vacuum reflow oven. This increases process reliability enormously, saves process costs and shortens the throughput times of the product in the production process. In combination with the necessary vacuum soldering system, the solder joints are virtually free of voids.

The solder paste is primarily used in DIE attach and power device packaging applications. The residue-free and void-free solder joint ensure good current and heat transfer in power electronics. When soldering DIE with DCB / DBC (direct copper bonded), high layer thicknesses are often required. The solder paste is designed for the special requirements of the printing process and can be modified to meet customer-specific requirements.

Up to now, preforms or solder pastes with classic flux have mostly been used in these applications. When using preforms, a preform must be purchased for each geometry. Solder paste printing is much more flexible here and can replace the high variance of preforms. When switching from resin-containing solder pastes to our T220-FL003-T3, the entire cleaning process, including surface inspection, can be eliminated. This increases process reliability, saves costs, reduces throughput times and unnecessary emissions.