Solder paste with optimized wetting properties especially for nickel surfaces
The NP303-GM855-GQ-2-1 solder paste was developed by GENMA especially for wetting nickel and copper surfaces. BGAs and QFPs are reliably soldered. The solder paste convinces with its excellent printability. Printability and solder behaviour are maintained at the same level even after 24 hours.
The solder paste can be soldered under air or nitrogen reflow. Cleaning after soldering is not necessary.
- Optimized for nickel surfaces
- Excellent wetting
- Good printability