Solder paste NP303-GM855-GQ-2-1 - GENMA Europe GmbH

NP303-GM855-GQ-2-1

Solder paste with optimized wetting properties especially for nickel surfaces

NP303-GM855-GQ-2-1

The NP303-GM855-GQ-2-1 solder paste was developed by GENMA especially for wetting nickel and copper surfaces. BGAs and QFPs are reliably soldered. The solder paste convinces with its excellent printability. Printability and solder behaviour are maintained at the same level even after 24 hours.

The solder paste can be soldered under air or nitrogen reflow. Cleaning after soldering is not necessary.

Product features:

  • Optimized for nickel surfaces
  • Excellent wetting
  • Good printability

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219