Solder paste NP303-LD155-GQ - GENMA Europe GmbH


SMD solder paste with very little flux residues

NP303-LD155-GQ solder paste

GENMA SMD solder paste – our NP303-LD155-GQ convinces with its outstanding contours stability after printing. The printed solder paste will not flatten out. The soldering process does not produce solder beads. The flux is kept at the soldering joint and does not spread on the PCB. Cleaning after soldering is not necessary. If necessary, residues can be easily removed. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • No solder beads
  • No flattening out
  • High contours stability
  • Very little flux residues

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 221