NP303-LD155-GQ
SMD solder paste with very little flux residues
NP303-LD155-GQ solder paste
GENMA SMD solder paste – our NP303-LD155-GQ convinces with its outstanding contours stability after printing. The printed solder paste will not flatten out. The soldering process does not produce solder beads. The flux is kept at the soldering joint and does not spread on the PCB. Cleaning after soldering is not necessary. If necessary, residues can be easily removed. The solder paste can be soldered under air or nitrogen reflow.
Product features:
- No solder beads
- No flattening out
- High contours stability
- Very little flux residues
Our services for you:
Technical Data:
Alloy
Flux type
Powder size
Melting temperature °C
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