Solder paste NP303-LD155-GQ - GENMA Europe GmbH

NP303-LD155-GQ

Solder paste with very little flux residues

NP303-LD155-GQ

GENMA solder paste – our NP303-LD155-GQ convinces with its outstanding contours stability after printing. The printed solder paste will not flatten out. The soldering process does not produce solder beads. Cleaning after soldering is not necessary. If necessary, residues can be easily removed. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • No solder beads
  • No flattening out
  • High contours stability
  • Very little flux residues

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219