Solder paste NP303-LHGQ-30KR - GENMA Europe GmbH


Halogen-free solder paste according to Apple standards


GENMA solder paste – our NP303-LHGQ-30 solder paste is halogen-free according to Apple standards. Excellent printability, long open time, and consistent adhesiveness during the pick-and-place process are characteristic for this solder paste. It good wetting properties, also on difficult surfaces, produce perfect soldering joints - also on BGAs.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • ROL0 – halogen-free solder paste according to Apple standards
  • Good printability
  • Good wetting properties
  • Consistent viscosity
  • Consistent adhesiveness

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219