Solder paste - GENMA Europe GmbH

NP303-MF155-GQ

High thixotropic solder paste with good printing and dispensing properties

NP303-MF155-GQ

GENMA solder paste – our NP303-MF155-GQ solder paste features a good printability, sufficient tackiness on the stencil, and a good adhesiveness during the pick-and-place process. Its good wetting properties guarantee consistent soldering joints. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Due to the high thixotropic index, the solder paste is well suited for dispensing.

Product features:

  • Good printability
  • Good adhesiveness during the pick-and-place process
  • High contours stability

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219