Solder paste NP303-PLD155-GQ - GENMA Europe GmbH

NP303-PLD155-GQ

Our special solder paste for pin-in-paste applications

NP303-PLD155-GQ

GENMA solder paste – our NP303-PLD155-GQ solder paste was specifically developed for pin-in-paste applications. During the soldering process, the solder paste safely sticks to the pin until it fully melts to make the solder connection. The solder paste will not drip during the process. The soldering paste's contours stability after printing is excellent. We recommend the nozzle screen method for printing the solder paste. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Especially for pin-in-paste applications
  • Excellent contours stability
  • Consistent adhesiveness after printing

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5

Flux type

ROL1

Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219