Solder paste NP303-PLD155-GQ - GENMA Europe GmbH


Our special SMD solder paste for pin-in-paste applications


GENMA SMD solder paste – our NP303-PLD155-GQ solder paste was specifically developed for pin-in-paste applications. During the soldering process, the solder paste safely sticks to the pin until it fully melts to make the solder connection. The solder paste will not drip during the process. The soldering paste's contours stability after printing is excellent. We recommend the nozzle screen method for printing the solder paste. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Especially for pin-in-paste applications
  • Excellent contours stability
  • Consistent adhesiveness after printing

Technical Data:


Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

217 - 219