NP303-VLP102-T5 solder paste

GENMA solder paste - our halogen-free "ultra low void" solder paste reaches void rates of less than 5% even with large-area components. The NP303-VLP102-T5 solder paste is designed for use in reflow ovens without a vacuum and impresses with very low void rates. During the soldering process, the ingredients in the flux that lead to voids dissolve. Therefore, compared to other solder pastes, our NP303-VLP102-T5 solder paste can achieve significantly lower void rates. The excellent wetting facilitates gas emission from the flux, so that voids are reduced. Conventional solder pastes usually have a void rate of 15% or more, with our "ultra low void" paste the void rate can be reduced to less than 5%. The solder paste has a very good printing behavior thanks to stable viscosity and thixotropy.

The lower the void rates of a solder paste, the more stable and reliable the connection. In power electronics, which is strongly influenced by the heat generated, low void rates are particularly important. A low void rate is particularly important for solder joints with large surfaces such as CuOSP / QFN and SON components. The solder connection with very few voids allows the current to flow through almost the entire surface, so less heat is generated and overheating of the electronics can be avoided. Another advantage is that no vacuum reflow oven is needed. This ensures massive cost savings and a significant increase in throughput. The solder paste is designed especially for large components with large surfaces, but the same excellent results are achieved with small components.