Type 4 solder paste with water soluble flux
NP303-WS4070-T4 solder paste
GENMA solder paste – our NP303-WS4070-T4 solder paste with water soluble flux. It convinces with its outstanding printability, highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering joints on BGAs.
Hardly any voids in the solder connections. Cleaning of flux residues with water after soldering is required. The solder paste can be soldered under air or nitrogen reflow.
- water soluble flux
- Outstanding printability
- Good tackiness
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process
Our services for you:
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
4 (22-38 µ m)
Melting temperature °C
217 - 221