NP303-WS7157-T7
Type 7 solder paste with water soluble flux
NP303-WS7157-T7 solder paste
GENMA solder paste – our NP303-WS7157-T7 solder paste with easy to clean water soluble flux. It convinces with its outstanding printability, highly precise contours and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, produce perfect soldering joints.
Hardly any voids in the solder connections. Cleaning of flux residues with water after soldering is required. The solder paste can be soldered under nitrogen reflow.
Product features:
- water soluble flux - easy to clean
- Outstanding printability
- Good tackiness
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process
Our services for you:
Technical Data:
Alloy
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
Flux type
ROL0-halogen-free
Powder size
7 (2-11 µ m)
Melting temperature °C
217 - 221
Similar products:
winDot F-005-NP303 T7
SMD jet dispenser solder paste. Type 7. Dot diameters of 130µm possible
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