Type 7 solder paste with water soluble flux
NP303-WS7157-T7 solder paste
GENMA solder paste – our NP303-WS7157-T7 solder paste with easy to clean water soluble flux. It convinces with its outstanding printability, highly precise contours and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, produce perfect soldering joints.
Hardly any voids in the solder connections. Cleaning of flux residues with water after soldering is required. The solder paste can be soldered under nitrogen reflow.
- water soluble flux - easy to clean
- Outstanding printability
- Good tackiness
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process
Our services for you:
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
7 (2-11 µ m)
Melting temperature °C
217 - 221