Type 5 solder paste for extremely fine structures
GENMA solder paste – our NP303-ZYA-1 solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering joints on BGAs.
Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- For fine structures
- Outstanding printability
- Good tackiness
- Excellent wetting
- Consistent adhesiveness during the pick-and-place process