Solder paste bismuth NP406-MGM555-GK - GENMA Europe GmbH


Bismuth solder paste for highest reliability with a slightly lower melting point than SAC305


GENMA solder paste – NP406-MGM555-GK is a special solder paste for highly reliable solder connections. The bismuth containing metal alloy convinces with its excellent thermal cycle resistance. As opposed to the SAC305 standard alloy, it features a clearly higher long-term durability of the soldering joints, however, its melting temperature is slightly lower. Its consistent viscosity guarantees outstanding printing properties. Based on its good wetting properties, BGAs can also be soldered perfectly.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow, although nitrogen reflow should be preferred.

Main applications: Electronic assemblies with higher requirements.

Product features:

  • High cycle resistance
  • Highly reliable solder connections
  • Outstanding printability
  • Outstanding wetting properties
  • Low melting temperature range

Technical Data:


Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5

Flux type


Powder size

3 (22-45 µ m)

Melting temperature °C

196 - 206