
SB58-COSMO-NH-T4
Air bubble free low-temperature dispensing solder paste for the second reflow solder process or extremely temperature-sensitive components
SB58-COSMO-NH-T4 dispensing solder paste
GENMA solder paste – our proven COSMO solder paste is now available with a low temperature alloy air bubble free for dispensing. The SB58-COSMO-NH-T4 is a low-temperature solder paste. Because of the low melting point it is used in areas where a second reflow solder process is necessary, for temperature-sensitive components or to save electricity with the lower reflow temperature needed.
The SB58-COSMO-NH-T4 SMD solder paste for dispensing convinces with it's highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates material planning. Due to its long shelf life and stability at room temperature, the paste is also ideal for rework with low consumption. Our SB58-COSMO-NH-T4 is vacuum degassed, which ensures uninterrupted dispensing even in automated applications. Furthermore, solder paste can be transported without cooling.
Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
The dispenser solder paste is available in 5cc, 10cc and 30cc cartridges.
Product features:
- Ideal for dispensing.
- Vacuum degassed; Air bubble free solder paste - Also ideal for automated applications.
- Very good stability.
- Extremely long shelf life - Also ideal for prototypes / small series.
- Excellent wetting properties.
- Low melting point.
- Halide free L0.
- Alloy of the solder paste does not contain silver.