Solder paste SB6-HLGQ-20 - GENMA Europe GmbH

SB6-HLGQ-20

Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components

SB6-HLGQ-20

GENMA solder paste – our SB6-HLGQ-20 is a low-temperature solder paste that is used in areas where a second reflow solder process is necessary or for temperature-sensitive components. The solder paste features good wetting properties and prints well.

Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Low-temperature solder paste
  • Good wetting properties
  • Good printability
  • Halide free - fulfilling Apple standard

Technical Data:

Alloy

Sn 42,6 / Bi 57 / Ag 0,4

Flux type

ROL0

Powder size

4 (22-38 µ m)

Melting temperature °C

139 - 141