Solder paste SB6-HLGQ-MSD - GENMA Europe GmbH

SB6-HLGQ-MSD

Low-temperature solder paste for pin-in-paste applications with a second reflow solder process or for very temperature-sensitive components

SB6-HLGQ-MSD

GENMA solder paste – our SB6-HLGQ-MSD solder paste is a low-temperature solder paste that was specifically developed for pin-in-paste applications. It is used in areas where a second reflow solder process is necessary or for very temperature-sensitive components. The solder paste features good wetting properties and prints well. We recommend the nozzle screen method for printing the solder paste.

Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Low-temperature solder paste
  • Application: Pin-in-paste
  • Good wetting properties
  • Good printability

Technical Data:

Alloy

Sn 42,6 / Bi 57 / Ag 0,4

Flux type

ROL0

Powder size

4 (22-38 µ m)

Melting temperature °C

139 - 141