Solder paste leaded T6204-GM155-GQ - GENMA Europe GmbH


Our proven lead-containing standard solder paste

T6204-GM155-GQ solder paste

GENMA solder paste – our lead-containing T6204-GM-155-GQ solder paste convinces with its outstanding printability, also in permanent printing applications. The solder paste produces sharp printing contours and features consistent adhesiveness during the pick-and-place process. Its consistent viscosity allows storage of up to 12 months which facilitates material planning. Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs. The broad melting temperature range of this alloy helps to prevent the tombstone effect.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Outstanding printability
  • Long tackiness
  • Solder connections low in voids
  • Reduced silver content
  • Contains lead

Technical Data:


Sn 62 / Pb 37,6 / Ag 0,4

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

179 - 190