Lead-containing solder paste with 2% silver
GENMA solder paste – our 6220-GM-155-GQ solder paste convinces with its outstanding printability, also in permanent printing applications. The solder paste produces sharp printing contours and features consistent adhesiveness during the pick-and-place process. Its consistent viscosity allows storage of up to 12 months which facilitates material planning. Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs.
Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.
- Outstanding printability
- Long tackiness
- Solder connections low in voids
- 2% silver