Solder paste leaded 6220-GM155-GQ - GENMA Europe GmbH


Lead-containing solder paste with 2% silver


GENMA solder paste – our 6220-GM-155-GQ solder paste convinces with its outstanding printability, also in permanent printing applications. The solder paste produces sharp printing contours and features consistent adhesiveness during the pick-and-place process. Its consistent viscosity allows storage of up to 12 months which facilitates material planning. Even on difficult surfaces, its excellent wetting properties provide for perfect soldering joints - also on BGAs.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • Outstanding printability
  • Long tackiness
  • Solder connections low in voids
  • 2% silver

Technical Data:


Sn 62 / Pb 36 / Ag 2,0

Flux type


Powder size

4 (22-38 µ m)

Melting temperature °C

179 - 179