Solder paste Typ 5 NP303-ZYA-1 - GENMA Europe GmbH

NP303-COSMO-LH-T5

Halide free Type 5 solder paste for extremely fine structures with excellent wetting properties

NP303-COSMO-LH-T5 - NEW

GENMA solder paste – our halide free NP303-COSMO-LH-T5 solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering joints on BGAs. Its extraordinarily consistent viscosity allows storage of up to 12 months which facilitates material planning. Moreover, solder paste can be transported without cooling.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Product features:

  • For fine structures
  • Outstanding printability
  • Long open time on stencil
  • Excellent wetting
  • Consistent adhesiveness during the pick-and-place process
  • Halide free according to Apple standard
  • Minimum shelf life of 12 months, transport without cooling

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL0

Powder size

5 (10-25 µ m)

Melting temperature °C

217 - 219