NP303-ZYA-1 solder paste

GENMA SMD solder paste – our NP303-ZYA-1 solder paste was developed for printing finest structures. It convinces with its outstanding printability, highly precise contours, long open time, and consistent adhesiveness in the pick-and-place process. Its extremely good wetting properties, also on difficult surfaces, produce perfect soldering joints on BGAs.

Hardly any voids in the solder connections. Cleaning after soldering is not necessary. The solder paste can be soldered under air or nitrogen reflow.

Please note: The follow-up product NP303-COSMO-LH-T5 has an improved wetting properties and the stability and printability was improved as well.

Product features:

For fine structures
Outstanding printability
Good tackiness
Excellent wetting
Consistent adhesiveness during the pick-and-place process

Our services for you:

Technical Data:

Alloy

Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

Flux type

ROL0-halogen-free

Powder size

5 (10-25 µ m)

Melting temperature °C

217 - 221

Similar products:

YS-RMA-NP303

Our standard for manual soldering featuring extremely quick wetting properties

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NP303-COSMO-LH-T5

Halide free type 5 SMD solder paste for extremely fine structures with excellent wetting properties