LEAD-CONTAINING SOLDER PASTE
Most industries switched to lead-free solder pastes when the RoHS Directive came into force in 2006. There are only a very few exceptions in which lead-containing solder pastes may be used. Exempt are, for example, safety-relevant components in the automotive, aviation, military, and medical engineering industries, where the safety of people has priority. There are suitable long-term tests for lead-containing solder joints that show that the requirements in these industries can be met.
As more and more applications use lead-free alloys, the production volumes of lead-containing solder pastes have been significantly reduced. We have adapted our range of lead-containing solder pastes so that we still have one type available in stock.
Advantages of lead-containing solder paste
- High elasticity of the alloy
- Low melting temperature range
- Broad melting range (tombstoning is prevented)
- Cost-efficient
- Quick wetting
- No whisker formation
|
Lead content |
Alloy | Melting range |
Tensile strength |
Ductility |
Wetting time |
| Lead-Containing | Sn62 / Pb37,6 / Ag0,4 (T6204) | 179 °C - 190 °C | 54 MPa | 23 % | 0,8 s |
| Lead-Free | Sn96,5 / Ag3 / Cu0,5 (NP303, SAC305) | 217 °C - 221 °C | 37 MPa | 31 % | 1,58 s |
Alloy: Sn 62 / Pb 37,6 / Ag 0,4
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