LOW-TEMPERATURE SOLDER PASTE
Low-temperature solder pastes are used in electronics production where the use of solder pastes based on SAC alloys is impossible due to the temperature sensitiveness of the components or printed circuit boards.
The most commonly used low-temperature solder paste is tin and bismuth-based. The advantage of this alloy is that it allows for the lowest soldering temperature. Its disadvantage is that the resulting solder connections are shock-sensitive in contrast to the SAC305 alloy.
Lead-free low temperature solder pastes in comparison
|
Alloy |
Description |
Melting range |
Weakness |
Strength |
|
Reference SN96,5 Ag3 Cu0,5 |
NP303 (SAC305) |
217 - 219 |
Reference |
Reference |
|
Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5 |
NP406 |
196 - 206 |
Expensive Alloy |
3x better cycle resistance (warm-cold) |
|
Sn 42 / Bi 58 |
SB58 |
139 - 141 |
Drop-shock sensitive |
Significant lower melting range |
Alloy: Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5
NP406-MGM555-GK
Indium SMD solder paste for highest reliability with a significant lower melting point than SAC305
more_horizAlloy: Sn 42 / Bi 58
SB58-COSMO-NH-T4
Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components. 12 Month shelf live
more_horizAlloy: Sn 42,6 / Bi 57 / Ag 0,4
SB6-HLGQ-MSD
SMD Low-temperature solder paste for pin-in-paste applications with a second reflow solder process or for very temperature-sensitive components
more_horizAlloy: Sn 62 / Pb 37,6 / Ag 0,4
Nichts Gefunden?
Sie benötigen eine andere Legierung oder haben weitere Anforderungen? Wir haben auch Produkte für Sonderanwendungen. Und falls da nichts dabei ist bieten wir auch kundenspezifische Produkte!