LOW-TEMPERATURE SOLDER PASTE
Low-temperature solder pastes are used in electronics production where the use of solder pastes based on SAC alloys is impossible due to the temperature sensitiveness of the components or printed circuit boards.
The most commonly used low-temperature solder paste is tin and bismuth-based. The advantage of this alloy is that it allows for the lowest soldering temperature. Its disadvantage is that the resulting solder connections are shock-sensitive in contrast to the SAC305 alloy.
Low temperature solder pastes in comparison
|
Alloy |
Description |
Melting Range |
Interesting Facts |
|
Sn 42 / Bi 58 |
SB58 |
138 °C |
Significantly low melting point. Part of the COSMO series, 12-month shelf life from production. Also available as a dispensing solder paste. |
|
Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5 |
NP406 |
196 °C – 206 °C |
3 x better thermal cycling resistance (hot-cold). Especially suitable for electronic assemblies with high reliability requirements. |
|
Sn 62 / Pb 37,6 / Ag 0,4 |
T6204 |
179 °C – 190 °C |
Lead-containing solder paste. COSMO series, 12-month shelf life from production. Low silver content. |
|
Reference SAC 305, Sn 96.5 / Ag 3 / Cu 0.5 |
NP303 |
217 °C – 221 °C |
Reference. |
Alloy: Sn 42 / Bi 58
SB58-COSMO-NH-T4
Low-temperature solder paste for the second reflow solder process or extremely temperature-sensitive components. 12 Month shelf live
more_horiz
SB58-COSMO-NH-T4 Dispenser
Air bubble free low-temperature dispensing solder paste for the second reflow solder process or extremely temperature-sensitive components. 12 Month shelf live
more_horizAlloy: Sn 90,0 / Ag 3,5 / In 6,0 / Bi 0,5
NP406-MGM555-GK
Indium SMD solder paste for highest reliability with a significant lower melting point than SAC305
more_horizAlloy: Sn 62 / Pb 37,6 / Ag 0,4
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