SAC305 SOLDER PASTE
The acronym SAC stands for the elements SnAgCu (tin, silver, and copper) of which the alloy consists. SAC alloys are the most commonly used alloys in electronics production.
SAC305
SAC305 is the lead-free standard alloy consisting of 96.5% tin, 3% silver, and 0.5% copper. Its silver content of 3% ensures optimal wetting properties and balanced properties in terms of thermal fatigue, strength of the solder connection, and resistance to mechanical stress.
Properties of the SAC305 alloy
| Melting range (°C) | 217-221 |
| Tensile strength (MPa) | 37 |
| Elongation at break (%) | 33 |
Alloy: Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
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Halide free type 4 SMD solder paste with excellent wetting properties, 12 month shelf live
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NP303-CQS-2
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NP303-GM855-T4-D
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NP303-MF155-GQ
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winDot F-005-NP303 T7
SMD jet dispenser solder paste. Type 7. Dot diameters of 130µm possible
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