SAC305 SOLDER PASTE

The acronym SAC stands for the elements SnAgCu (tin, silver, and copper) of which the alloy consists. SAC alloys are the most commonly used alloys in electronics production.

SAC305

SAC305 is the lead-free standard alloy consisting of 96.5% tin, 3% silver, and 0.5% copper. Its silver content of 3% ensures optimal wetting properties and balanced properties in terms of thermal fatigue, strength of the solder connection, and resistance to mechanical stress.

Properties of the SAC305 alloy

Melting range (°C) 217-221
Tensile strength (MPa) 37
Elongation at break (%) 33

 

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Alloys

Alloy: Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305

NP303-COSMO-LH-T4

Halide free type 4 SMD solder paste with excellent wetting properties

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NP303-COSMO-LH-T5

Halide free type 5 SMD solder paste for extremely fine structures with excellent wetting properties

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Solder paste lead free - GENMA Europe GmbH

NP303-COSMO-ZQ-C

Our top product – ROL1 SMD solder paste with the best printing and soldering properties

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Solder paste lead free - GENMA Europe GmbH

NP303-CQS-1

Halide free SMD solder paste with excellent printing and soldering properties

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Solder paste lead free - GENMA Europe GmbH

NP303-CQS-2

ROL0 SMD solder paste with higher viscosity and excellent printing and soldering properties

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Solder paste lead free - GENMA Europe GmbH

NP303-ZYA-1

Type 5 SMD solder paste for extremely fine structures

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NP303-TP100-T6

Type 6 SMD solder paste for extremely fine structures with excellent wetting properties

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NP303-GM855-T4-D

Solder paste with optimized wetting properties for oxidized- and nickel surfaces

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Solder paste lead free - GENMA Europe GmbH

NP303-PLD155-GQ

Our special SMD solder paste for pin-in-paste applications

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Solder paste lead free - GENMA Europe GmbH

NP303-WS4070-T4

Type 4 solder paste with water soluble flux

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Solder paste lead free - GENMA Europe GmbH

NP303-WS4070-T5

Type 5 solder paste with water soluble flux

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Solder paste lead free - GENMA Europe GmbH

NP303-WS4070-T6

Type 6 solder paste with water soluble flux

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Solder paste lead free - GENMA Europe GmbH

NP303-WS7157-GT7

Type 7 solder paste with water soluble flux

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Solder paste lead free - GENMA Europe GmbH

NP303-WS7157-GT8

Type 8 solder paste with water soluble flux

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Solder paste lead free - GENMA Europe GmbH

NP303-LD155-GQ

SMD solder paste with very little flux residues

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Solder paste can and cartridge lead free - GENMA Europe GmbH

NP303-MF155-GQ

High thixotropic SMD solder paste with good printing and dispensing properties

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Dispenser solder paste in cartridges - GENMA Europe GmbH

NP303-LHY-LS T5

SMD dispenser solder paste for laser or reflow soldering

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winDot S-005-NP303 T5

SMD Jet dispenser solder paste Type 5 for jet dispensing

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winDot B-005-NP303 T6

Jetting solder paste Type 6 for jet dispensing

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winDot F-005-NP303 T7

SMD jet dispenser solder paste. Type 7. Dot diameters of 130µm possible

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