Soldering joints without flux or tin spatter
GENMA solder wire – the GST-NP303 solder wire is spatter-free. No contamination by flux or tin spatter on the board. Its good wetting properties allow quick soldering processes. Cleaning after soldering is not necessary.
- No tin or flux spatter
- Good wetting properties
- SAC305 alloy
Sn 96,5 / Ag 3,0 / Cu 0,5 / SAC305
Melting temperature °C
217 - 219